COURSE # MRO-233
ACHIEVING IMPROVED RELIABILITY THROUGH
ENVIRONMENTAL STRESS SCREENING
December 8-10, 2008, in Washington, DC
…proven reliability concepts that lead to product cost reduction presented in the most practical of terms, covering the reasons, tools and methods that work…
This course addresses practical pathways toward manufacturing cost reduction through product reliability improvement. It explores ways to reduce or eliminate the impact of life-limiting failure mechanisms in design and manufacturing processes. Participants will review actual reliability case studies and have opportunities to develop working solutions for their own products.
Applications and benefits:
You will benefit by enhancing your understanding of the:
- The principles and tools used in reliability engineering and how to apply them productively in your company's screening, quality enhancement, and reliability improvement programs.
- Why, how and when to perform environmental stress screening.
- How to use ESS to enhance product robustness and manufacturability.
- How to evaluate and specify supplier reliability performance.
- Leading edge reliability improvement approaches including Parametric Screening and STRIFE (Stress Testing for Reliability Improvement).
Who should attend:
Managers, Designers, Manufacturing Engineers, Quality Engineers, Reliability Engineers, and others involved in improving product quality and reliability will benefit from attending this course. There are no prerequisites for this course; however, some background in engineering or sciences is helpful.
Course Outline:
Day 1
- Electronic Product Reliability Life
- Infant Mortality - Its causes and duration
- Random Life - Its causes and duration
- Wearout - its causes and duration
- Mechanical Product Reliability Life - its causes and duration
- Arrehenius Equation and its Proper Application
- Electromigration
- Voltage Accelerated Mechanisms
- Humidity
- High Cycle Fatigue
- Low Cycle Fatigue
- Crack Growth
- Random Vibration and Related
- Mechanisms
- Thermal Cycling
- Solder Cracking
- Thin Film Cracking
- Creep
- Failure Rate Calculations
- Confidence Limits and Intervals
- Multiple Failure Mechanisms
- Probability of Failure Free Operation
Day 2
-
Assignment Review
- Demonstration of Reliability Software
- Basic Screening Concepts
- Benefits of Stress Screening
- Effects of Bad Parts on a Board
- Destruct Limits of Products and How to Define Them
- Why good units aren't harmed during stressing
- Cost of Failures
- Types of Screens
- Screen Levels - Pros & Cons
- Designing a Good Screen
- Checking for Screen Effectiveness
- STRIFE
- Screens for Common Failure Mechanisms and Their Effectiveness
- Recommendations for Card Assemblies and Unit Screening
- Parametric Screening - What, How, and Why
- Additional Sources of Information
- Practical Assignment
Day 3
- Assignment Review
- Review of Actual Product Screens - Part and Unit
- Team Screen Development Session
- Team Screen Program Presentation and Critique
Text: Practical Reliability Engineering, by Patrick D. T. O’Connor
About the Instructors
Dr. Andrew Kostic is a recognized authority in Product Reliability, Quality, and Failure Analysis. Dr. Kostic has been involved with all phases of the product life cycle in computer, aerospace, and medical industries. He is currently a Fellow Engineer at the Northrop Grumman Electronic Systems Division Product Integrity Department. Previously, Dr. Kostic held senior technical positions at Unisys and IBM.
Dr. Kostic’s classes have been taught around the world and are especially valued for their practicality.
Details:
Course: MRO-233 Duration: 3 Days FEE: $1,499 CEUs: 2.16
Please direct any additional inquiries regarding this course to Anita Hellstrom, Program Coordinator, by e-mail, FAX: (240) 371-4488 or TELEPHONE: (301) 871-9608.
Call toll free 1-800-683-7267 from anywhere in the Continental U.S. or CANADA.
Last modified July 3, 2008.
